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2019年半导体行业深度研究报告

2019年半导体行业深度研究报告 内容目录 1. 投资逻辑:行业自身成长+中国厂商进口替代 ...........................................4 投资逻辑之一:行业自身成长......................................................................4 1.1.集成电路设备成长动力:先进制程+新晶圆厂投产..................................4 1.2.LED 芯片行业设备成长动力:LED 芯片应用扩大+行业生产效率提升.....6 投资逻辑之二:中国厂商进口替代空间广阔.................................................8 投资逻辑之三:科创板主打硬核科技,半导体设备公司直接受益 ...............10 2. 半导体主流设备分析 ..............................................................................10 半导体制造相关设备..................................................................................10 1.晶圆清洗(wafer Cleaning )..................................................................10 2.氧化(Oxidation) ................................................................................. 11 3.薄膜沉积(Film Deposition )——占晶圆制造 20%................................. 11 4.曝光(Exposure)——占晶圆制造 20% .................................................12 5.显影(Development)............................................................................12 6.刻蚀(Etch)——占晶圆制造环节 25%..................................................13 7.离子注入(Ion Implantation) ................................................................13 8.化学机械抛光(Chemical Mechanical Polisher ) ...................................13 工艺检测与封测相关设备...........................................................................14 9.探针检测(wafer Probe ) ......................................................................14 10.切割机(Dicing) .................................................................................14 11.键合( Bonding).................................................................................14 12.测试机 3. ..........................................................................................14 行业内重点公司简析 ..............................................................................15 3.1.中微半导体——硬核科技的代表 ..........................................................15 3.2.北方华创——A 股半导体设备公司稀缺标的 .........................................16 3.3.长川科技 ..........................................................................................17 3.4.上海微电子..........................................................................................19 4. 5. 推荐标的 ................................................................................................21 风险提示 ................................................................................................21 图表目录 图表 1:半导体设备产业链 ...............................................................