当前位置:首页 >> 信息与通信 >>

pc817(光耦隔离)

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

November 2005

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Features

■ AC input response (FOD814 only)

■ Applicable to Pb-free IR re?ow soldering

■ Compact 4-pin package

■ Current transfer ratio in selected groups:

FOD617A: 40–80%

FOD817: 50–600%

FOD617B: 63–125%

FOD817A:80–160%

FOD617C: 100–200% FOD817B: 130–260%

FOD617D: 160–320% FOD817C:200–400%

FOD814: 20–300%

FOD817D:300–600%

FOD814A: 50–150%

■ C-UL, UL and VDE approved

■ High input-output isolation voltage of 5000Vrms

■ Higher operating temperatures (versus FODXXX counterparts)

■ Minimum BVCEO of 70V guaranteed

Applications
FOD814 Series ■ AC line monitor ■ Unknown polarity DC sensor ■ Telephone line interface
FOD617 and FOD817 Series ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs
Description
The FOD814 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a silicon phototransistor output in a 4-pin dual in-line package. The FOD617/817 Series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a 4-pin dual in-line package.

Functional Block Diagram

ANODE, CATHODE 1

4 COLLECTOR

ANODE 1

4 COLLECTOR

CATHODE, ANODE 2

3 EMITTER

CATHODE 2

3 EMITTER

4

FOD814

FOD617/817

1

?2005 Fairchild Semiconductor Corporation

1

FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Absolute Maximum Ratings (TA = 25°C Unless otherwise speci?ed.)

Value

Parameter

Symbol

FOD814 FOD617/817

TOTAL DEVICE

Storage Temperature Operating Temperature Lead Solder Temperature Total Power Dissipation EMITTER

TSTG TOPR TSOL P TOT

-55 to +150

-55 to +105

-55 to +110

260 for 10 sec

200

Continuous Forward Current Reverse Voltage Power Dissipation
Derate above 100°C

IF

±50

50

VR



6

PD

70

1.7

DETECTOR

Collector-Emitter Voltage Emitter-Collector Voltage

VCEO VECO

70

6

6 (FOD817)

7 (FOD617)

Continuous Collector Current
Collector Power Dissipation Derate above 90°C

IC

50

PC

150

2.9

Units
°C °C °C mW
mA
mW mW/°C
V V
mA mW mW/°C

2 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Electrical/Characteristics (TA = 25°C Unless otherwise speci?ed.)

Individual Component Characteristics

Parameter

Device Test Conditions Symbol Min Typ* Max Unit

EMITTER

Forward Voltage Reverse Leakage Current Terminal Capacitance

FOD814

(IF = ±20 mA)

VF

FOD617

(IF = 60 mA)

FOD817

(IF = 20 mA)

FOD617

(VR = 6.0 V)

IR

FOD817

(VR = 4.0 V)

FOD814 (V = 0, f = 1 kHz)

Ct

FOD617 (V = 0, f = 1 kHz)

FOD817 (V = 0, f = 1 kHz)



1.2

1.4

V

— 1.35 1.65



1.2

1.4

— 0.001 10

?A





10



50

250 pF



30

250



30

250

DETECTOR

Collector Dark Current

FOD814 FOD617C/
D FOD617A/
B FOD817

(VCE = 20 V, IF = 0) (VCE = 10 V, IF = 0) (VCE = 10 V, IF = 0) (VCE = 20 V, IF = 0)

ICEO





100 nA



1

100



1

50





100

Collector-Emitter Breakdown Voltage
Emitter-Collector Breakdown Voltage

FOD814 (IC = 0.1 mA, IF = 0) BVCEO

70





V

FOD617 (IC = 100 ?A, IF = 0)

70





FOD817 (IC = 0.1 mA, IF = 0)

70





FOD814 (IE = 10 ?A, IF = 0) BVECO

6





V

FOD617 (IE = 10 ?A, IF = 0)

7





FOD817 (IE = 10 ?A, IF = 0)

6





Transfer Characteristics (TA = 25°C Unless otherwise speci?ed.)

DC Characteristic Device

Test Conditions

Symbol Min

Current Transfer Ratio

FOD814 FOD814A

IF = ±1 mA, VCE = 5 V1

CTR

20

50

FOD617A

IF = 10 mA, VCE = 5 V1

40

FOD617B

63

FOD617C

100

FOD617D

160

FOD617A

IF = 1 mA, VCE = 5 V1

13

FOD617B

22

FOD617C

34

FOD617D

56

FOD817

IF = 5 mA, VCE = 5 V1

50

FOD817A

80

FOD817B

130

FOD817C

200

FOD817D

300

Collector-Emitter FOD814 Saturation Voltage FOD617

IF = ±20 mA, IC = 1 mA IF = 10 mA, IC = 2.5 mA

VCE (sat) — —

FOD817

IF = 20 mA, IC = 1 mA



Cut-Off Frequency FOD814 VCE = 5 V, IC = 2 mA, RL = 100 ?, -3dB fC

15

*Typical values at TA = 25°C

Typ* —

Max Unit 300 % 150 80 125 200 320

— 600 — 160 — 260 — 400 — 600 0.1 0.2 V — 0.4 0.1 0.2 80 — KHz

3 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Transfer Characteristics (continued) (TA = 25°C Unless otherwise speci?ed.)

AC Characteristic Response Time (Rise)

Device
FOD814 FOD617 FOD817

Test Conditions

Symbol Min

VCE = 2 V, IC = 2 mA, RL = 100 ?2

tr



Response Time (Fall)

FOD814 FOD617 FOD817

tf



Typ* Max Unit

4

18 ?s

3

18 ?s

Isolation Characteristics

Characteristic

Device

Input-Output Isolation Voltage3

FOD814 FOD617

FOD817

Isolation Resistance

FOD814

FOD617

FOD817

Isolation Capacitance

FOD814

FOD617

FOD817

Test Conditions Symbol f = 60Hz, t = 1 min VISO

Min 5000

VI-O = 500 VDC

RISO

5x1010

VI-O = 0, f = 1 MHz

CISO

Typ* 1x1011
0.6

*Typical values at TA = 25°C
Notes 1. Current Transfer Ratio (CTR) = IC/IF x 100%. 2. For test circuit setup and waveforms, refer to page 4. 3. For this test, Pins 1 and 2 are common, and Pins 3 and 4 are common.

Max Units Vac(rms)



?

1.0

pf

4 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

COLLECTOR POWER DISSIPATION PC (mW)

COLLECTOR POWER DISSIPATION PC (mW)

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise speci?ed.)

Fig. 1 Collector Power Dissipation vs. Ambient Temperature (FOD814) 200

Fig. 2 Collector Power Dissipation vs. Ambient Temperature (FOD617/817) 200

150

150

100

100

50

50

COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V)

0 -55 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

Fig. 3 Collector-Emitter Saturation Voltage

vs. Forward Current 6

Ic = 0.5m A Ta = 25°C

5

1m A

3m A

5m A 4
7m A

3

2

1

0 0 2.5 5.0 7.5 10.0 12.5 15.0
FORWARD CURRENT IF (mA)

Fig. 5 Forward Current vs. Forward Voltage (FOD617/817)
100

TA = 110oC 75oC

10

50oC

25oC 0oC
-30oC
1
-55oC

0.1 0.5

1.0

1.5

2.0

FORWARD VOLTAGE VF (V)

CURRENT TRANSFER RATIO CTR ( %)

FORWARD CURRENT IF (mA)

0 -55 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

Fig. 4 Forward Current vs. Forward Voltage (FOD814)
100

TA = 105oC 75oC

10

50oC

25oC 0oC
-30oC
1
-55oC

0.1 0.5

1.0

1.5

2.0

FORWARD VOLTAGE VF (V)

Fig. 6 Current Transfer Ratio vs. Forward Current
140 V = 5V Ta= 25°C
120 FOD617/817
100
80
60 FOD814
40
20
0 0. 1 0.2 0.5 1 2 5 10 20 50 100
FORWARD CURRENT IF (mA)

FORWARD CURRENT IF (mA)

5 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise speci?ed.)

COLLECTOR CURRENT IC (mA)

Fig. 7 Collector Current vs. Collector-Emitter Voltage (FOD814)

50 IF = 30mA

Ta= 25°C

40

30

20 m A

Pc (M AX.)

10m A 20
5m A 10
1m A 0
0 10 20 30 40 50 60 70 80 90 100
COLLECTOR-EMITTER VOLTAGE VCE (V)

COLLECTOR CURRENT IC (mA)

Fig. 8 Collector Current vs. Collector-Emitter Voltage (FOD617/817)

30 I IF = 30mA

Ta = 25°C

25

20mA

Pc(MAX.)

20

15 10mA
10 5m A
5

0 0 10 20 30 40 50 60 70 80 90
COLLECTOR-EMITTER VOLTAGE VCE (V)

RELATIVE CURRENT TRANSFER RATIO (%)

Fig. 9 Relative Current Transfer Ratio

vs. Ambient Temperature 160
FOD814

140

IF = 1 mA

VCE = 5V

120

100

80 FOD617/817

60

IF = 5mA VCE = 5V

40

20

0 -60 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

Fig. 11 LED Power Dissipation vs. Ambient Temperature (FOD814) 100
80
60
40
20
0 -55 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

LED POWER DISSIPATION PLED (mW)

COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V)

Fig. 10 Collector-Emitter Saturation Voltage

vs. Ambient Temperature

0.12 0.10

I = 20mA
F
IC = 1mA

0.08

0.06

0.04

0.02

0.00 -60 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

Fig. 12 LED Power Dissipation vs. Ambient Temperature (FOD617/817) 100
80
60
40
20
0 -55 -40 -20 0 20 40 60 80 100 120
AMBIENT TEMPERATURE TA (°C)

LED POWER DISSIPATION PLED (mW)

6 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

RESPONSE TIME (?s) COLLECTOR DARK CURRENT ICEO (nA)
VOLTAGE GAIN AV (dB)

Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise speci?ed.)

Fig. 13 Response Time

vs. Load Resistance

100 VCE = 2V
50 Ic= 2mA

Ta = 25°C 20

tr

10

tf

5

td

2

ts

1

0.5

0.2
0.1 0.1 0.2 0.5 1 2 5 10
LOAD RESISTANCE RL (k?)

Fig. 14 Frequency Response

VCE = 2V

Ic = 2mA

0

Ta = 25°C

RL=10k

1k

100

-10

-20

0.2 0.5 15 2 10

100

FREQUENCY f (kHz)

1000

Fig. 15 Collector Dark Current

10000

vs. Ambient Temperature

1000

VCE = 20V

100

10

1

0.1

0.01 -60 -40 -20 0 20 40 60 80 100 120 AMBIENT TEMPERATURE TA (°C)

Test Circuit for Response Time

Input RD

Vcc

Input

Output

RL Output

td tr

10%
90% ts
tf

Test Circuit for Frequency Response Vcc

RD

RL

Output

7 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

SEATING PLANE

0.200 (5.10) 0.161 (4.10)
0.157 (4.00) 0.118 (3.00)

0.130 (3.30) 0.091 (2.30)
0.150 (3.80) 0.110 (2.80)
0.110 (2.79) 0.090 (2.29)

0.020 (0.51) TYP
0.024 (0.60) 0.016 (0.40)

0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00)
0.300 (7.62) typ

0.010 (0.26)

SEATING PLANE

0.200 (5.10) 0.161 (4.10)

0.157 (4.00) 0.118 (3.00)

0.051 (1.30) 0.043 (1.10)

0.024 (0.60) 0.004 (0.10)

0.110 (2.79) 0.090 (2.29)
Lead Coplanarity 0.004 (0.10) MAX

0.312 (7.92) 0.288 (7.32) 0.276 (7.00) 0.236 (6.00)
0.049 (1.25) 0.030 (0.76) 0.412 (10.46) 0.388 (9.86)

0.010 (0.26)

Package Dimensions (0.4” Lead Spacing)

0.200 (5.10) 0.161 (4.10)

0.157 (4.00) 0.118 (3.00)

0.312 (7.92) 0.288 (7.32)
0.276 (7.00) 0.236 (6.00)

SEATING PLANE

0.130 (3.30) 0.091 (2.30)
0.150 (3.80) 0.110 (2.80)
0.024 (0.60) 0.016 (0.40)

0.110 (2.79) 0.090 (2.29)

0.110 (2.80) 0.011 (1.80)
0.42 (10.66) 0.38 (9.66)

0.291 (7.40) 0.252 (6.40)
0.010 (0.26)

Footprint Dimensions (Surface Mount)
1.5 1.3
9
2.54

NOTE All dimensions are in inches (millimeters)

8 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Ordering Information

Option S SD W 300
300W 3S 3SD

Part Number Example FOD814S FOD814SD FOD814W FOD814300
FOD814300W FOD8143S FOD8143SD

Marking Information

Description Surface Mount Lead Bend Surface Mount; Tape and reel
0.4" Lead Spacing VDE Approved
VDE Approved, 0.4" Lead Spacing VDE Approved, Surface Mount
VDE Approved, Surface Mount, Tape & Reel

4

5

V X ZZ Y 6

3

814

2

1

De?nitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code

9 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Carrier Tape Specifications
?1.55±0.05
NOTE All dimensions are in millimeters
Description Tape wide Pitch of sprocket holes Distance of compartment Distance of compartment to compartment Compartment

P2

P0

1.75±0.1

A0 P1

F W
B0
0.3±0.05
K0

Symbol W P0 F P2 P1 A0 B0 K0

Dimensions in mm (inches) 16 ± 0.3 (.63) 4 ± 0.1 (.15) 7.5 ± 0.1 (.295) 2 ± 0.1 (.079) 12 ± 0.1 (.472)
10.45 ± 0.1 (.411) 5.30 ± 0.1 (.209) 4.25 ± 0.1 (.167)

10 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

Temperature (°C)

Lead Free recommended IR Re?ow condition Tp
Tsmax Tsmin

Ramp-down

25°C

ts (Preheat)

Time (sec)

Soldering zon

Pro?le Feature Preheat condition (Tsmin-Tsmax / ts) Melt soldering zone
Peak temperature (Tp) Ramp-down rate

Pb-Sn solder assembly
100°C ~ 150°C 60 ~ 120 sec
183°C 60 ~ 120 sec 240 +0/-5°C 6°C/sec max.

Lead Free assembly
150°C ~ 200°C 60 ~120 sec 217°C 30 ~ 90 sec 260 +0/-5°C 6°C/sec max.

Recommended Wave Soldering condition
Pro?le Feature Peak temperature (Tp)

For all solder assembly Max 260°C for 10 sec

11 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

FOD814 Series, FOD617 Series, FOD817 Series 4-Pin Phototransistor Optocouplers

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

ACEx?

FAST?

ActiveArray? FASTr?

Bottomless? FPS?

Build it Now? FRFET?

CoolFET?

GlobalOptoisolator?

CROSSVOLT? GTO?

DOME?

HiSeC?

EcoSPARK? I2C?

E2CMOS?

i-Lo?

EnSigna?

ImpliedDisconnect?

FACT?

IntelliMAX?

FACT Quiet Series?

Across the board. Around the world.? The Power Franchise?
Programmable Active Droop?

DISCLAIMER

ISOPLANAR? LittleFET? MICROCOUPLER? MicroFET? MicroPak? MICROWIRE? MSX? MSXPro? OCX? OCXPro? OPTOLOGIC? OPTOPLANAR? PACMAN? POP? Power247?
PowerEdge?

PowerSaver? PowerTrench? QFET? QS? QT Optoelectronics? Quiet Series? RapidConfigure? RapidConnect? ?SerDes? ScalarPump? SILENT SWITCHER? SMART START? SPM? Stealth? SuperFET? SuperSOT?-3

SuperSOT?-6
SuperSOT?-8 SyncFET? TinyLogic? TINYOPTO? TruTranslation? UHC? UltraFET? UniFET? VCX?
Wire?

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY

FAIRCHILDíS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or

2. A critical component is any component of a life

systems which, (a) are intended for surgical implant into

support device or system whose failure to perform can

the body, or (b) support or sustain life, or (c) whose

be reasonably expected to cause the failure of the life

failure to perform when properly used in accordance

support device or system, or to affect its safety or

with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the

effectiveness.

user.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative or In Design

This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

No Identification Needed

Full Production

This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

Obsolete

Not In Production

This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I17

12 FOD814 Series, FOD617 Series, FOD817 Series Rev. 1.0.2

www.fairchildsemi.com

This datasheet has been downloaded from: www.EEworld.com.cn
Free Download Daily Updated Database 100% Free Datasheet Search Site 100% Free IC Replacement Search Site Convenient Electronic Dictionary
Fast Search System www.EEworld.com.cn
All Datasheets Cannot Be Modified Without Permission Copyright ? Each Manufacturing Company


相关文章:
pc817(光耦隔离)_图文.pdf
pc817(光耦隔离) - 光耦隔离用,通常与稳压管一起用... pc817(光耦隔离)_信息与通信_工程科技_专业资料。光耦隔离用,通常与稳压管一起用 FOD814 Series, FOD617...
PC817光耦_图文.doc
PC817光耦 - PC817光电耦合器/光耦 封装:DIP4 质量:全新进口 尺寸参数(单位 mm) : PC817光电耦合器广泛用在电脑终端机,可控硅系统设备,测量仪器,影印机,自动...
为什么要使用PC817光耦.doc
为什么要使用PC817光耦 - 在电子行业中,有各种不同的电源器件。其中就有光电耦合器,而光耦又分为A、B、C、D、L几档,在市场上最受大众欢迎的还是C档。PC817...
详解PC817光耦的重要参数CTR值.doc
详解PC817光耦的重要参数CTR值 - CTR:发光管的电流和光敏三极管的电流比的最小值。 隔离电压:发光管和光敏三极管的隔离电压的最小值。 光耦的技术参数主要有...
光耦PC817中文解析.pdf
光耦PC817中文解析 - 光耦 PC817 解析 PC817 说明: pc817 是常用的线性光藕,在各种要求比较精密的功能电路中常常被当作耦 合器件,具有上下级电路完全隔离的作用...
基于PC817做的光耦隔离线性比例传输-实现电压电流的隔离.pdf
基于PC817做的光耦隔离线性比例传输-实现电压电流的隔离_电子/电路_工程科技_专业资料。利用普通PC817实现模拟量的隔离比例传输, 电压输入 +0V~+250V -12V +12V...
光电耦合器PC817.doc
加热器等电路之间的信号传输, 使之前端与负载完全隔离,目的在于增加安全性,减小...至此,四脚光耦PC817的管脚排列已完全确定,如附图所示。至于多脚 型光耦合管的...
光耦pc817与P521光耦的应用.doc
光耦pc817 应用电路 pc817 是常用的线性光藕,在各种要求比较精密的功能电路中常常被当作耦合器 件,具有上下级电路完全隔离的作用,相互不产生影响。 <光耦 pc817 ...
光耦pc817与P521光耦的应用(1).doc
光耦pc817 应用电路 pc817 是常用的线性光藕,在各种要求比较精密的功能电路中常常被当作耦合器 件,具有上下级电路完全隔离的作用,相互不产生影响。 <光耦 pc817 ...
光耦pc817应用电路.doc
光耦pc817应用电路 - pc817 是常用的线性光藕,在各种要求比较精密的功能电路中常常被当作耦合器 件,具有上下级电路完全隔离的作用,相互不产生影响。 <光耦 pc817...
PC817光耦.pdf
PC817光耦 - PC817 Series PC817 Series .. s
光耦pc817应用电路与pdf中文资料.doc
光耦pc817 应用电路与 pdf 中文资料 发布于 2009-02-27 被读 2935 次 【...在各种要求比较精密的功能电路中常常被当作耦合器件,具有上下级电路完全隔离的作用...
光耦817参数PC817有什么型号可以替代?.doc
光耦817参数PC817有什么型号可以替代? - 深圳市兴凯翔科技 原装正品
PC817 光耦-光电耦合器.pdf
PC817 光耦-光电耦合器_计算机硬件及网络_IT/计算机_专业资料。PC817 R ○ 4...pc817(光耦隔离) 13页 1下载券 光耦pc817应用电路 5页 1下载券 喜欢...
PC817A光电耦合器.doc
PC817A光电耦合器 - PC817A/B/C--- 电光耦合器 光耦特性与应用 1.概述 光耦合器亦称光电隔离器,简称光耦。光耦合器以光为媒介传输电信号。它 对输入、 ...
PC817使用手册.pdf
PC817使用手册_信息与通信_工程科技_专业资料。PC817使用手册PC817 DIP4 : 1. 2. PC817 CTR:IF=5mA,VCE=5V 50% Viso(rms):5.0 KV : 1. 2. 3. 4...
光耦pc817与P521光耦的应用(2).doc
光耦pc817与P521光耦的应用(2)_信息与通信_工程科技_专业资料。各类光耦的应用...线性光电耦合器 是一种新型的光电隔离器件,能够传输连续变化的模拟电压或电流信号...
TL431是如何结合光耦PC817工作.doc
TL431是如何结合光耦PC817工作 - 对于图 1 的电路,就是要确定 R1
PC817光电耦合器_图文.doc
PC817光电耦合器 - PC817光电耦合器/光耦 PC817光电耦合器广泛用
PC817光耦.pdf
Compact dual-in-line package PC817 : 1-channel type PC827 : 2-channel ...pc817(光耦隔离) 13页 免费 PC817 系列规格书 10页 免费 光耦pc817应用电路...