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LF Deveopment for Future Needs handout


Leadframe Development For Future Needs

引线框架的未来发展

ASM Pacific Technology Ltd. ? 2007

Electronic Component Packaging Needs

芯片封装件的需求
Low Cost 低成本 High Performance 高性能 Application Specific 特殊应用

Source: The Worldwide IC Packaging Market 2007 Edition
ASM Pacific Technology Ltd. ? 2007

Material Price Trend

原材價格走勢
Trend of LME Copper Price
USD/MT
USD/MT

Trend of LME Nickel Price
60,000

8,000 7,000 6,000 5,000 4,000 3,000 2,000 1,000 May-05 May-06 Mar-05 Mar-06 Nov-05 Nov-06 Sep-05 Sep-06 Mar-07 Jan-05 Jan-06 Jan-07 Jul-05 Jul-06
Latest (4-May): 8225.0

Latest (4-May): 52,600

50,000 40,000 30,000 20,000 10,000 Nov-05 Nov-06 Jan-05 Jul-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 May-05 May-06 Sep-05 Sep-06 Mar-07

Month

Series1

Month
Series1

USD / Troy Ounce 15.00

Trend of Silver Price

USD / Troy Ounce

700 650

Trend of Gold Price

13.00
Latest (4-May) :

600 550 500

11.00 9.00 7.00 5.00 3.00
Nov-05 May-05 May-06 Nov-06 Jul-05 Jan-05 Jan-06 Jul-06 Mar-05 Mar-06 Jan-07 Sep-05 Sep-06 Mar-07

Latest (4-May) : 684.8

450 400 350 300 250 200
May-05 May-06 Mar-05 Mar-06 Sep-05 Sep-06 Mar-07
Series1

Jul-05

Nov-05

Jul-06

Nov-06

Jan-05

Jan-06

Month

Series1

M onth

ASM Pacific Technology Ltd. ? 2007

Jan-07

Low Cost 低成本

ASM Pacific Technology Ltd. ? 2007

Open Tool Leader

公用模具的领先者
SOJ SC70

Low Cost

TQFP 14x14 PDIP SOT23 TSSOP TQFP 14x20

TSOP(I) SOP MSOP SSOP

ASM Pacific Technology Ltd. ? 2007

Open Tool Advantages

公用模具的优势
? Save cost in expensive precision tooling 节省模具的开发费用 ? Low leadframe cost due to economy of scale 规模效益可降低引線框架的制造成本 ? Short delivery lead time due to common parts in production 主流产品的交货周期较短 ? Perfection in leadframe design as tuned by various customers 吸纳不同客户的反馈使引线框架的设计力臻 完美

Low Cost

ASM Pacific Technology Ltd. ? 2007

High Density Matrix

高密度矩阵
SO 8L (256unit)

Low Cost

TSSOP / MSOP 8L (320unit)

TQFP (7x7) 48L (60unit)

QFN 3L - MCD (8,816unit)
ASM Pacific Technology Ltd. ? 2007

New Platform For Small Package

小型封裝件的最新框架设计
Standard frame size 70x238mm, easy conversion 统一的框架外形尺寸, 方便产品转换
SO 8L (256unit)
Vs typical design 140units 与普通型比较 Density 密度: +83% Material consumption: -21% 材料耗用

Low Cost

MSOP 8L/10L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用

TSSOP 8L (320unit)
Vs typical design 100units 与普通型比较 Density 密度: +220% Material consumption: -51% 材料耗用

ASM Pacific Technology Ltd. ? 2007

Field Proven By Volume Production SO 8L 256units
Shipment (Million Units)

Low Cost

Cumulative Production

Close to 1 billion units!

Oct,05

Feb,05

Feb,06

Mar,05

Mar,06

May,05

May,06

Nov,05

Dec,05

Oct,06

Jan,06

Jun,06

Jul,06

Nov,06

June,05

ASM Pacific Technology Ltd. ? 2007

Sep, 06

Aug,05

Aug,06

Dec,06

July,05

Sep,05

1000 900 800 700 600 500 400 300 200 100 0

Start launching to market

Apr,05

Apr,06

Palladium Pre-plated Frame Pre-plated

镍钯金预电镀框架
Increasing demand 渐成主流
Support green packaging (lead-free) 滿足 ’无铅’ 环保要求 Lower assembly cost due to elimination of solder plating process 省去封装过程中的镀锡工序从而进一步降低封装成本
70000 60000 50000 Units (M)

Low Cost

Leadframe Finish Forecast

Pd PPF
40000 30000 20000 10000 0 2005 2006 2007 Year 2008

Ni/Pd/Au PPF Sn/Pb Matte Tin Sn/Bi Sn/Ag/Cu Sn/Cu

Source: IC Packaging Materials 2006 Edition

2009

2010

ASM Pacific Technology Ltd. ? 2007

Typical Plating Scheme

典型的电镀规格
3-layer structure (Ni/Pd/Au) 三层结构(镍/钯/金) Pd at min 20nm (0.8?”) 钯厚度最少20纳米
Au: 3~9 nm (0.1~0.3?”)

Low Cost

3-layer structure 三层结构

Pd: 20~100 nm (0.8~4?”) Ni: 0.5~2.0 ?m (20~80?”)

Leadframe base metal

ASM Pacific Technology Ltd. ? 2007

Thin Pd PPF PPF

薄钯的预电镀框架
Thinner Pd for lower leadframe cost 薄钯可降低框架成本
Reduction from min 20nm to 10nm (0.8?” to 0.4?”)
减低钯镀层的厚度 Au: 3~9 nm (0.1~0.3?”) Pd: 10~100 nm (0.4~4?”) Ni: 0.5~2.0 ?m (20~80?”)

Low Cost

Leadframe base metal

ASM Pacific Technology Ltd. ? 2007

Thin Plating Measurement

薄钯电镀层的测量
State-of-the-art capability
顶级的测量能力 Good resolution 微细的分辨率 2.5? (0.01?”) Good accuracy 微细的精确度 10nm Pd at +/- 12.5? 10 纳米厚度的钯层 VXR (精准度达 +/- 0.8纳米) Good applicability 灵活的应用范围 Measurement area 75nm, i.e. any spot on the lead surface 测量区域 > 75纳米,也就是脚表面的任何位置

Low Cost

Quality control 质量控制
Short measuring time 测量时间短 Used in routine IPQC 可用于日常的IPQC检查中使用

ASM Pacific Technology Ltd. ? 2007

Thermal Devices Forecast

散热型封装件的预测

Low Cost

Source: IC Packaging Materials 2006 Edition

ASM Pacific Technology Ltd. ? 2007

Thermal Enhancement Feature

增强散热性
1.

Low Cost

Heat Spreader (expensive) 外接散热片(昂贵) MSOP (D/S 0.43mm)
Additional metal slug

LQFP (D/S 0.80mm)

2.

Exposed DAP by deep downset 深度打凹使矽座外露

Exposed DAP by Deep D/S

ASM Pacific Technology Ltd. ? 2007

Lead Up-set Products Up-set

内脚反向打凹的产品
Using lead up-bending (reverse downset) to simulate half-material-thickness feature of etched frame 模拟腐蚀片中半腐蚀的特性,将内脚反向打凹 Increasing inquiry with diversified pkg designs 应用于不同的封装类形 TEP 5L DFN 6L

Low Cost

DFN 8L

ASM Pacific Technology Ltd. ? 2007

Application Specific 特殊应用

ASM Pacific Technology Ltd. ? 2007

Flip Chip Device Forecast

倒装芯片封装体的预测

Application Specific

ASM Pacific Technology Ltd. ? 2007

Power Device

功率器件
较厚的原材料厚度可加快热量的扩散

Thick material (0.50mm) to enhance thermal dissipation

Application Specific

ASM Pacific Technology Ltd. ? 2007

High Performance 高性能

ASM Pacific Technology Ltd. ? 2007

High Pin Count QFN QFN 高腳數的QFN
Dual-row leaded 双排脚的设计
High Performance

Lead configuration under zigzag pattern 脚的设计呈锯齿状 House more I/Os within same body size 在相同大小的封装 体内容纳更多的输入/输出

ASM Pacific Technology Ltd. ? 2007

Double-sawn Type Double-sawn

双排切割型
Some leads originated from pad edge 矽座边缘有脚 Allow wider lead width for multiple wire bonding 可容纳较大的打线空间, 增加焊线数量 Require 2x sawing 需两次切割
High Performance

ASM Pacific Technology Ltd. ? 2007

Fine Pitch QFN QFN 内脚小间距的QFN产品
48L 5x5mm package
0.3mm lead pitch on 0.203mm thick material 0.203mm厚的原材料而内脚间距只有 0.3mm External lead width 外脚宽 : 0.130 ±0.030 mm Connecting bar width 连接筋宽度 : 0.165 ±0.050 mm
High Performance

ASM Pacific Technology Ltd. ? 2007

Selective Plating (Photo-resist Masking) (Photo-resist

局部电镀(光阻材料型电镀模)
High Performance

Photo Mask(光阻型电镀模)
No bleed on z axis (Z轴无溢出)

Mechanical Mask(机械型电镀模)

Lead Tip
Ag bleed on z axis (Z轴有漏银)

Lead Tip

No bleed on z axis (Z轴无溢出)

Pad
Ag bleed on z axis (Z轴有漏银)

Pad

ASM Pacific Technology Ltd. ? 2007

Selective Plating (Application)

局部电镀的应用
High Performance

25
ASM Pacific Technology Ltd. ? 2007

Brown Oxide Treatment (BOT)

棕色氧化处理
Polar bonding by changing surface chemistry
材料表面的化学变化增加其黏着性
High Performance

Surface roughening by fibrillar copper oxide
纤维状的铜氧化物使表面粗糙

12kX

FIB/SEM Photo
ASM Pacific Technology Ltd. ? 2007

26kx

Field Recognition(业内认可)
Customer Product Status

A B C

TSSOP 38L SO 8L SO 8L SO 16,20,28L DIP IDF 8L TSSOP 38L

Passed L3 Passed L1 Passed L1 Passed L1 Passed L1

High Performance

D E F G H J K L
ASM Pacific Technology Ltd. ? 2007

Passed L3 & thermal cycling 1000 hrs

TQFP 100L 14x14 Passed L1 & PCT 96hrs (LF-EMC) SOT 3L Passed L1 SOIK 8L Passed L3 TQFP 44, 80L Passed L1 MQFP 44L 10x10 Passed L1 TSOP(I) 56L Passed L3 48L QFN 7x7 Passed L2 68L QFN 10x10 Passed L3

New Version BOT For QFN 针对QFN的棕色氧化处理
Fresh copper exposed after tape removal, no oxide cleaning is needed prior to solder plating compared with double-side oxide treatment 与双面的棕色氧化比较,去除胶纸后的纯净铜于镀锡之前无需去氧化
处理
High Performance

Minimize EMC flash after molding, save additional leadframe cleaning process (cost)
减少成型时的黑胶外溢,省却残胶清洗工序以降低成本 Top Bottom

Ag Brown Oxide

Fresh Cu Brown Oxide

ASM Pacific Technology Ltd. ? 2007

World Class Auto-line For BOT Auto-line

国际级的棕色氧化自动生产线
High Design and build in-house 自主研发及制造 Performance Better quality assured 良好的品质保证 Computerized process control 电脑化的生产程序控制 Fully automatic, minimized frame handling 全自动操作,减少人手 处理 High capacity 高产能

ASM Pacific Technology Ltd. ? 2007

Thanks you!

ASM Pacific Technology Ltd. ? 2007


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